文章摘要
引用本文:陈 晖,陈淑梅.浸没式光刻机内薄边界浸液流动的仿真分析[J].福州大学学报(自然科学版),2013,41(6):1056~1060
浸没式光刻机内薄边界浸液流动的仿真分析
Simulation analysis of immersion flow with small boundary thickness in immersion lithography
  
DOI:10.7631/issn.1000-2243.2013.06.1056
中文关键词: 光刻机  浸液流动  硅片扫描  计算流体动力学
英文关键词: lithography machine  immersion flow  wafer scanning  computational fluid dynamics
基金项目:
作者单位
陈 晖 福州大学机械工程及自动化学院福建 福州 350116 
陈淑梅 福州大学机械工程及自动化学院福建 福州 350116 
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中文摘要:
      硅片扫描速度的不断提升是45nm以下浸没式光刻的发展趋势,由此带来的液体泄漏问题日益凸显. 降低液体边界厚度可有效提高抑制泄漏的表面张力,却改变了传统浸液流场的应力分布及流动规律. 基于计算流体动力学方法,建立浸液流场的三维数值模型,在液体下界面的硅片处于高速扫描状态下,研究薄边界浸液流动的压力特征及液体更新效率,相关结果与已有试验吻合性好. 研究结果显示,边界厚度取0.3~0.5mm时可取得最佳的抗泄漏效果,同时硅片沿压差流方向运动时边界压力最小且液体更新稳定,研究结果对增强光刻过程的可靠性和密封性提供了参考依据.
英文摘要:
      Increasing wafer scanning-velocity is the trend of the development of immersion lithography when the critical dimension is less than 45nm,and the problem of liquid leakage becomes more serious. Lower thickness of liquid boundary brings larger surface tension to prevent leakage,but it leads to different pressure distribution and flow behavior. Based on the method of computational fluid dynamics,the three-dimensional model of immersion liquid field is developed. It is applied to investigate the pressure characteristics and renovation efficiency of immersion flow with small boundary thickness under the high scanning-velocity of wafer which is the bottom interface of immersion liquid. The simulation results agree well with the existed experimental results. The results show that the cases with 0.3~0.5mm boundary thickness have optimal ability to avoid leakage,and the minimum pressure in liquid boundary and stable liquid renovation are obtained as wafer scans along the direction of the differential pressure flow. They also provide a reference to enhance the reliability and sealing property in the process of lithography.
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